Industry Semiconductors20 JUN 2026

Chinese semiconductor companies adopt glass substrate packaging to bypass TSMC patents

Chinese chipmakers are pivoting to glass substrate packaging as a deliberate route around TSMC's dominant patent position in advanced packaging. A new partnership between JD.com and Corning marks a concrete signal of accelerating domestic momentum behind this strategy.

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Industry AI & Digital14 July 2026

Tencent moves to acquire Manus stake as Meta exits at no premium

Tencent is leading a Chinese consortium buyback of Meta's stake in AI agent company Manus at a valuation of approximately $2 billion — the same price Meta paid in Q1 2026.

Industry AI & Digital14 July 2026

Chinese quantum computing companies consolidate capital around distinct technical routes

China's quantum computing sector is concentrating investment around three competing technical pathways — superconducting, neutral atom, and photonic — though no company-to-pathway mapping has been confirmed for the five named actors collectively.

Industry AI & Digital29 June 2026

Shenzhen's smart hardware ecosystem faces deep competitive reshuffling

DJI's Pocket 4P sold out within seconds of its June 23 launch, while Insta360's Luna faces months of backlog — a 'sweet problem' for leading brands, and demand that would have been unimaginable three years ago.